MicroBox V130
MicroBox V130
Part Number:MicroBox V130 SKU Number:4467
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MicroBox V130

The MicroBox V130 Mini-ITX fanless small form factor system is powered by a Via C7 processor

The fanless aluminum and steel case provides protection in environments where dust and dirt predominate and are ideal for locations requiring silent operation. Heat generated by the system is dissipated by the dual purpose aluminum case, that is designed with fins, similar to a heatsink, and heatpipes that draw heat away from the processor. The fanless design improves system reliabiltiy by preventing potential mechanical failures.

For mission critical network applications the hard disk drive can be replaced with a solid state drive to become a shock proof and noise free reliable system with no moving parts that could potentially fail.

 

System Features
» Mini-Desktop Compact Fanless Network Appliance
»

Supports VIA C7 Processors

» Up to 1GB of DDR2 533MHz Memory
» 1x 3.5" SATA Hard Drive
» One Fast Ethernet or One Gigabit Ethernet

VIA C7 Processor with 21 mm NanoBGA2 Technology

The new VIA C7® processor is the smallest, lowest power, most efficient and most secure native x86 processor in the world. Built on the advanced VIA CoolStream architecture, the 'Esther' core of the VIA C7 processor is designed to provide robust performance of up to 2.0GHz with ultra low power consumption and highly efficient heat dissipation.

Low Power by Design
Developed from the ground up for low power operation, the VIA C7 processor is based on the advanced VIA CoolStream™ Architecture and manufactured using state-of-the-art 90nm Silicon-on-Insulator (SOI) process, and delivers the greatest performance per watt in the business.

The onboard 1.5GHz processor has an ultra low power consumption of around 12 watts peak power and operating at an average power of less than 1 watt.


Fanless System, for ultimate reliability

Fanless Systems are great for environments where dust and dirt predominate and are ideal for locations requiring silent operation. Our systems utilize heat pipe technology and aluminum fins for passive cooling. The absence of moving fans reduces the failure rate of systems in harsh environments.

In addition to being fanless this system offers a sealed enclosure from the elements. Even in the most clean and climate-controlled environments, dust and potentially conductive debris will be infused into the unit over time. The picture to the left shows a unit that was returned for service after approximately two years of operation in a computer room environment (not generally considered to be a harsh environment). Infused debris can cause bridging of circuits due to conductive material coming to rest across insulating barriers. Alternately, dust build up acts as a reservoir for ionic contaminates and moisture entrapment from humidity. Over time, these can enable the growth of conductive dendrites that may ultimately bridge insulating barriers

Read more about the benefits of a fanless system

MicroBox V130 Highlighted Items are Optional

Specification Board
Processor & Chipset EN15000G CN13000G CN10000EG
Processor

VIA C7 1.5GHz Processor

VIA C7 1.3GHz Processor VIA C7 1.0GHz Fanless Processor
Number of CPUs (std/max) 1/1
Processor Cooling

Fanless Heatsink

Fanless Heatsink Fanless Heatsink
Chipset

VIA CN700 North Bridge
VIA VT8237R South Bridge

Memory
Memory Capacity Up to 1GB of DDR2 533 MHz SDRAM memory
Memory Sockets 1x 240pin DIMM socket
DIMM Sizes 128MB, 256MB, 512MB, 1GB
Standard / Integrated Devices EN15000G CN13000G CN10000EG
Graphics Integrated VIA UniChrome Pro AGP graphics with MPEG-2 accelerator
1600 x 1200 Maximum (VGA)
1024 x 768 Maximum (LVDS/TTL)
Network Controllers

VIA VT6122 10 / 100 / 1000Mbps Gigabit Ethernet Controller

VIA VT6103 10 / 100Mbps Fast Ethernet Controller VIA VT6103 10 / 100Mbps Fast Ethernet Controller
Audio VIA VT1618 6-channel AC'97 codec VIA VT1618 8-channel AC'97 codec VIA VT1618 8-channel AC'97 codec
TV Out VIA 1625 HDTV encoder VIA 1625M HDTV encoder VIA 1625M HDTV encoder
IEEE1394 VIA VT6307S IEEE (FireWire) None
I/O Ports
Rear Panel I/O Ports

1x PS2 mouse port
1x PS2 keyboard port
1x RJ-45 LAN port
1x Serial port
4x USB 2.0 ports
1x VGA port
1x TV-out port
1x S-Video port
3x Audio jacks: line-out, line-in and mic-in (Horizontal, Smart 5.1 Support)

Internal I/O

2x SATA
2x IDE
2x USB 2.0 port headers
1x IEEE 1394a header
CD/Aux Audio in and Speaker out
1x LPC/SIR
1x SMBus connector
1x SPDIF connector
1x LVDS/TTL/DVI module connector (add-on module is required)
1x Component (YPbPr) video pin header

2x SATA
2x IDE
2x USB 2.0 port headers
1x IEEE 1394a header
Front panel audio connector
1x LPT connector
1x CIR connector
2x SATA
2x IDE
2x USB 2.0 port headers
1x IEEE 1394a header
Front panel audio connector
1x LPT connector
1x CIR connector
Storage and Media
Number of hard drives supported 1x 2.5" Notebook Hard Drive
Interface type supported IDE and SATA
Storage Controllers VIA VT8237R
Drive Bays None
Chassis and Power Supply
Form Factor Nano System
Case Material Aluminum and Steel
Total # of Drive Bays
Internal 3.5" Bays   1
System Cooling

None, fanless system cooled by heat sink/heat pipe combination on mainboard
with chassis fins

Chassis Dimensions
(w x h x d)

220mm x 50mm x 310mm
8.7" x 2.1" x 12.1"

External Power Adapter AC input 100 ~ 240V
Output DC 19V @ 6.32A
Power Convertor
Output 120W
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